The demand of the customers for Bare Die increases steadily. Reasons are space and volume reduction (e.g. for intelligent id-cards and mobiles) and the high reliability under rough environmental conditions (e.g. high temperature range in automotive applications). New requirements and particularities e.g. packaging and the delivery form as well as feasible process parameters for further handling, require an optimised customer-supplier interface.

With the elaborated questionnaire, the Working group of the Electronic Component Division within the German Electrical and Electronic Manufactures Association ZVEI did an important step into this direction. 
The questionnaire structure respectivetly its numbering is according  to the international standard IEC 62 258.

For further questions please contact: Dr. Rolf Winter